Detailed Product Description

• Provide FPC, PCB, PCBA (pcb assembly) service   Product Technic Parameter
  Item		Parameter
  		Double sided	Multilayer
  Number of Layers		2	4~16
  Copper Thickness		0.25~3.0OZ	0.5~3.0OZ
  Base Board Thickness		0.3~3.2mm	0.6~3.2mm
  Incombustibility		94V-0	94V-0
  Peelable resistance		12.3N/cm	12.3N/cm
  Twist		≤0.5%	≤0.5%
  Insulation resistance		≥1011Ω	≥1011Ω
  Test voltage		10-300V	10-300V
  Finished board area		560×970mm	560×970mm
  Min. Line Width and Spacing		0.1/0.1mm	0.1/0.1mm
  Copper thickness in hole		≥25.0um	≥25.0um
  Mini. pad diameter	Inner layer		0.05mm
  	Out layer	0.076mm	0.076mm
  Mini. Hole Diameter		0.25mm	0.20mm
  Hole tolerance	PTH	±0.076mm	±0.076mm
  	NPTH	±0.05mm	±0.05mm
  Hole location tolerance		±0.076mm	±0.05mm
  profile tolerance	Routing	±0.1mm	±0.1mm
  	Punching	±0.13mm	±0.13mm
  Solder mask bridge ability		≥0.1mm	≥0.075mm
  Solder mask rigidity		6H	6H
  Solderable test		245     5 second	245     5 second
  Thermal cycling ability		288     10 second	288     10 second
  Surface Finishing		OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger	OSP, HAL, Immersion gold , Gold plating, Rosin, Gold finger
  Qaulity standard		IPC-A-600F   IPC-ML-950	IPC-A-600F   IPC-ML-950
  Sample standard		STD-105E-	STD-106E-